Sitaraman, Suresh K. : rechercher sur Z-Library

Soldering & Surface Mount Technology

Année:

2015

Langue:

english

Fichier:

PDF, 2.35 MB

english, 2015

The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies

Tian, Ye, Chow, Justin, Liu, Xi, Sitaraman, Suresh K.

Journal:

Année:

2015

Langue:

english

Fichier:

PDF, 392 KB

english, 2015

Study of Chip–Package Interaction Parameters on Interlayer Dielectric Crack Propagation

Raghavan, Sathyanarayanan, Schmadlak, Ilko, Leal, George, Sitaraman, Suresh K.

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2014

Langue:

english

Fichier:

PDF, 1.61 MB

english, 2014

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Ahmad, Mudasir, Sitaraman, Suresh K.

Journal:

Kwatra, Abhishek, Samet, David, Rambhatla, V.N.N. Trilochan, Sitaraman, Suresh K.

Année:

2002

Langue:

english

Fichier:

PDF, 498 KB

english, 2002

Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination

Journal:

Lin, Ziyin, Liu, Yan, Raghavan, Sathyanarayanan, Moon, Kyoung-sik, Sitaraman, Suresh K., Wong, Ching-ping

Année:

2020

Fichier:

PDF, 1.59 MB

2020

Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation

Journal:

ACS Applied Materials & Interfaces

Année:

2013

Langue:

english

Fichier:

PDF, 1.62 MB

english, 2013

Reliability Assessment of Through-Silicon Vias in Multi-Die Stack Packages

Liu, Xi, Chen, Qiao, Sundaram, Venkatesh, Simmons-Matthews, Margaret, Wachtler, Kurt P., Tummala, Rao R., Sitaraman, Suresh K.

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2012

Langue:

english

Fichier:

PDF, 1.21 MB

english, 2012

Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates

Lee, Kang J., Damani, Manoj, Pucha, Raghuram V., Bhattacharya, Swapan K., Tummala, Rao R., Sitaraman, Suresh K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2007

Langue:

english

Fichier:

PDF, 1.76 MB

english, 2007

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

Pucha, Raghuram V., Tunga, Krishna, Pyland, James, Sitaraman, Suresh K.

Journal:

Xie, Weidong, Sitaraman, Suresh K.

Année:

2004

Langue:

english

Fichier:

PDF, 747 KB

english, 2004

Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

Journal:

Zhang, Xuchen, Nasr, Mohamed H., Woodrum, David C., Green, Craig E., Kottke, Peter A., Sarvey, Thomas E., Joshi, Yogendra K., Sitaraman, Suresh K., Fedorov, Andrei G., Bakir, Muhannad S.

Année:

2000

Langue:

english

Fichier:

PDF, 119 KB

english, 2000

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins

Année:

2016

Langue:

english

Fichier:

PDF, 795 KB

english, 2016

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

Variyam, Manjula N., Xie, Weidong, Sitaraman, Suresh K.

Journal:

Modi, Mitul, Sitaraman, Suresh K.

Année:

2000

Langue:

english

Fichier:

PDF, 645 KB

english, 2000

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

Journal:

Zhu, Qi, Ma, Lunyu, Sitaraman, Suresh K.

Année:

2004

Langue:

english

Fichier:

PDF, 1008 KB

english, 2004

Development of G-Helix Structure as Off-Chip Interconnect

Journal:

Tunga, Krishna, Sitaraman, Suresh K.

Année:

2004

Langue:

english

Fichier:

PDF, 527 KB

english, 2004

An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

Journal:

Journal of Applied Polymer Science

Année:

2007

Langue:

english

Fichier:

PDF, 502 KB

english, 2007

Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux™ 81) for high density interconnect applications

Rajiv C. Dunne, Suresh K. Sitaraman, Shijian Luo, Yang Rao, C. P. Wong, William E. Estes, Ceferino G. Gonzalez, John C. Coburn, Mookan Periyasamy

Journal:

Année:

2000

Langue:

english

Fichier:

PDF, 248 KB

english, 2000

An experimental technique to determine critical stress intensity factors for delamination initiation

Weidong Xie, Suresh K Sitaraman

Journal:

Mitul B. Modi, Suresh K. Sitaraman

Année:

2003

Langue:

english

Fichier:

PDF, 237 KB

english, 2003

Interfacial fracture toughness measurement for thin film interfaces

Journal:

Andy Perkins, Suresh K. Sitaraman

Année:

2004

Langue:

english

Fichier:

PDF, 437 KB

english, 2004

Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages

Journal:

Krishna Tunga, Suresh K. Sitaraman

Année:

2007

Langue:

english

Fichier:

PDF, 486 KB

english, 2007

Laser moiré interferometry for fatigue life prediction of lead-free solders

Journal:

Shashikant Hegde, Raghuram V. Pucha, Suresh K. Sitaraman

Année:

2010

Langue:

english

Fichier:

PDF, 1.88 MB

english, 2010

Enhanced reliability of high-density wiring (HDW) substrates through new base substrate and dielectric materials

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2004

Langue:

english

Fichier:

PDF, 544 KB

english, 2004

[IEEE 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO) - Birmingham, United Kingdom (2012.08.20-2012.08.23)] 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO) - The fabrication of ultra long metal nanowire bumps and their application as interconnects

Xu, Ju, Razeeb, Kafil M., Sitaraman, Suresh K., Mathewson, Alan

Année:

2012

Langue:

english

Fichier:

PDF, 1.72 MB

english, 2012

Compliance analysis of multi-path fan-shaped interconnects

Chen, Wei, Okereke, Raphael, Sitaraman, Suresh K.

Journal:

Année:

2013

Langue:

english

Fichier:

PDF, 2.48 MB

english, 2013

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

Tian, Ye, Liu, Xi, Chow, Justin, Wu, Yi Ping, Sitaraman, Suresh K.

Journal:

Année:

2014

Langue:

english

Fichier:

PDF, 1.17 MB

english, 2014

Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test

Liu, Xi, Chen, Qiao, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K.

Journal:

Kacker, Karan, Sitaraman, Suresh K.

Année:

2013

Langue:

english

Fichier:

PDF, 1.67 MB

english, 2013

Design and Fabrication of FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate Interconnects

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2008

Langue:

english

Fichier:

PDF, 1.19 MB

english, 2008

Experimental and Simulation Study of Double-Sided Flip-Chip Assembly With a Stiffener Ring

Liu, Xi, Li, Ming, Mullen, Donald R., Cline, Julia, Sitaraman, Suresh K.

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2014

Langue:

english

Fichier:

PDF, 2.74 MB

english, 2014

Silicon and Nanoscale Metal Interface Characterization Using Stress-Engineered Superlayer Test Methods

Zheng, Jiantao, Modi, Mitul, Ginga, Nicholas, Sitaraman, Suresh

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2009

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2009

Response Surface and Multiobjective Optimization Methodology for the Design of Compliant Interconnects

Wei Chen,, Sitaraman, Suresh K.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2014

Langue:

english

Fichier:

PDF, 2.34 MB

english, 2014

In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation

Liu, Xi, Thadesar, Paragkumar A., Taylor, Christine L., Oh, Hanju, Kunz, Martin, Tamura, Nobumichi, Bakir, Muhannad S., Sitaraman, Suresh K.

Journal:

Applied Physics Letters

Année:

2014

Langue:

english

Fichier:

PDF, 4.36 MB

english, 2014

Domed and Released Thin-Film Construct—An Approach for Material Characterization and Compliant Interconnects

Ostrowicki, Gregory T., Fritz, Nathan T., Okereke, Raphael I., Kohl, Paul A., Sitaraman, Suresh K.

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2012

Langue:

english

Fichier:

PDF, 723 KB

english, 2012

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Design and assembly of a double-sided 3D package with a controller and a DRAM stack

Liu, Xi, Li, Ming, Mullen, Don, Cline, Julia, Sitaraman, Suresh K.

Année:

2012

Langue:

english

Fichier:

PDF, 1.26 MB

english, 2012

Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection

Klein, Kevin M., Ostrowicki, Gregory, Gewirtz, Andrew T., Sitaraman, Suresh K.

Journal:

Liu, Xi, Zheng, Jiantao, Sitaraman, Suresh K.

Année:

2009

Langue:

english

Fichier:

PDF, 463 KB

english, 2009

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Journal:

Chen, Wei, Bhat, Anirudh, Sitaraman, Suresh K.

Année:

2010

Langue:

english

Fichier:

PDF, 1.42 MB

english, 2010

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Journal:

McCann, Scott, Sato, Yoichiro, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K.

Année:

2015

Langue:

english

Fichier:

PDF, 4.28 MB

english, 2015

Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2016

Langue:

english

Fichier:

PDF, 1.78 MB

english, 2016

Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications

Chen, Qiao, Liu, Xi, Sundaram, Venkatesh, Sitaraman, Suresh K., Tummala, Rao R.

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2014

Langue:

english

Fichier:

PDF, 2.00 MB

english, 2014

Cyclic magnetic actuation technique for thin film interfacial fatigue crack propagation

Ostrowicki, Gregory T., Sitaraman, Suresh K.

Journal:

McCann, Scott, Kuramochi, Satoru, Yun, Hobie, Sundaram, Venkatesh, Pulugurtha, M. Raj, Tummala, Rao R., Sitaraman, Suresh K.

Année:

2016

Langue:

english

Fichier:

PDF, 1.41 MB

english, 2016

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Board-Level Reliability of 3D through Glass via Filters During Thermal Cycling

Année:

2016

Langue:

english

Fichier:

PDF, 509 KB

english, 2016

Process Innovations to Prevent Glass Substrate Fracture From RDL Stress and Singulation Defects

McCann, Scott, Singh, Bhupender, Smet, Vanessa, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K.

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2016

Langue:

english

Fichier:

PDF, 1.82 MB

english, 2016

[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration - Reliable Design of TSV in Free-Standing Wafers and 3D Integrated Packages

Liu, Xi, Simmons-Matthews, Margaret, Wachtler, Kurt P., Sitaraman, Suresh K.

Année:

2011

Langue:

english

Fichier:

PDF, 2.19 MB

english, 2011

Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package

Perkins, Andy, Sitaraman, Suresh K.

Journal:

Krieger, William E. R., Raghavan, Sathyanarayanan, Sitaraman, Suresh K.

Année:

2008

Langue:

english

Fichier:

PDF, 1.66 MB

english, 2008

Experiments for Obtaining Cohesive-Zone Parameters for Copper-Mold Compound Interfacial Delamination

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2016

Langue:

english

Fichier:

PDF, 1.92 MB

english, 2016

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Micro and Nano Thin Film Devices as Bio-Assays for Cancer Diagnosis

Klein, Kevin M., Ostrowicki, Gregory T., Gerwitz, Andrew, Sitaraman, Suresh K.

Année:

2006

Langue:

english

Fichier:

PDF, 1.36 MB

english, 2006

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Mahalingam, Saketh, Prabhakumar, Ananth, Tonapi, Sandeep, Sitaraman, Suresh K.

Journal:

Raghavan, Sathyanarayanan, Sitaraman, Suresh K.

Année:

2008

Langue:

english

Fichier:

PDF, 496 KB

english, 2008

Shear test on hard coated flip-chip bumps to measure back end of the line stack reliability

Journal:

Okereke, Raphael, Kacker, Karan, Sitaraman, Suresh K.

Année:

2017

Langue:

english

Fichier:

PDF, 2.91 MB

english, 2017

Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

Journal:

McCann, Scott, Ostrowicki, Gregory T., Tran, Anh, Huang, Timothy, Bernhard, Tobias, Tummala, Rao R., Sitaraman, Suresh K.

Année:

2013

Langue:

english

Fichier:

PDF, 2.18 MB

english, 2013

Determination of Energy Release Rate Through Sequential Crack Extension

Journal:

Bhattacharya, Swapan, Varadarajan, Mahesh, Chahal, Premjeet, Lee, K. J., Bhattacharjee, Ajanta, Tummala, Rao R., Sitaraman, Suresh, Papapolymerou, John, Tentzeris, Manos, Laskar, Joy

Année:

2017

Langue:

english

Fichier:

PDF, 1.62 MB

english, 2017

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - SOP Embedded Thin Film Resistors on High and Low Loss Thin Film Dielectrics

Année:

2005

Langue:

english

Fichier:

PDF, 465 KB

english, 2005

Random vibration analysis of 3-Arc-Fan compliant interconnects

Chung, Philip Y., Sitaraman, Suresh K.

Journal: